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VD56GA delivers 35% higher image sharpness & nearly 60% higher infrared sensitivity than the previous generation.
September 21, 2026
By: Rachel Klemovitch
STMicroelectronics introduces ST SafeSense VD56GA, a new 1.1 MP automotive image sensor for infrared in-cabin sensing that helps OEMs and Tier 1 suppliers scale driver and occupant monitoring across vehicle lines while balancing performance, integration, and cost.
The VD56GA is a compact sensor architecture with high infrared sensitivity and embedded image-processing features that can help simplify camera design and integration. The sensor is designed to give camera developers the image quality needed for driver and occupant monitoring while preserving the size and cost advantages of a compact format.
In many in-cabin use cases, this can help customers meet performance targets without moving to a larger, more expensive sensor.
VD56GA is designed to help reduce the cost of the complete camera module. Its imaging performance enables the use of lower-cost optics, simplified infrared illumination, less demanding optical filtering, and no external image-processing.
For OEMs and Tier 1s, that can translate into a more cost-effective path to deploying driver and occupant monitoring across a broader range of vehicle programs.
The sensor leverages a new backside-illuminated pixel architecture, called ST DeepNIR, optimized for infrared imaging.
With 35% higher modulation transfer function (MTF) sharpness and nearly 60% higher quantum efficiency than the previous generation, VD56GA is currently the only sensor in its class to achieve this level of combined optical resolution and infrared sensitivity, helping in challenging conditions like under-display camera.
Designed for modern automotive camera modules, VD56GA is housed in a 3.7 mm x 3.2 mm CSP package, making it suitable for space-constrained installations and next-generation in-cabin camera designs.
The device also integrates a range of embedded image-processing functions, including mirror, crop, dark calibration, auto exposure, and piecewise-linear processing.
“In-cabin sensing is moving beyond premium platforms, and carmakers need cost-effective solutions they can deploy broadly,” said Alexandre Balmefrezol, Executive Vice President and General Manager of the Imaging Sub-Group at STMicroelectronics. “With VD56GA, we focused on the system-level tradeoffs that matter most: image quality in infrared conditions, compact integration, and a cost structure that supports high-volume programs. Equally important, the sensor benefits from ST’s Integrated Device Manufacturer model, with front-end manufacturing in Crolles, France, giving customers greater supply-chain resilience, quality control, and long-term support for automotive programs.”
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